The future of Power Electronics

The future of Power Electronics is expected move in the following directions:

• The future will demand Integrated Systems for electronic power processing. A more multi-disciplinary approach is needed for new achievements in integration, packaging, reliability and cost reduction.
• Intelligent control and energy management will come easily. Thermal and passive component integration is equally important.
• Large penetration of power electronics into power systems, mainly in distributed generation.
• Large-scale use of power electronics in automotive applications. This largely depends on political decisions as well as technology advances.
• Advances in high current, higher voltage devices will have a major impact on traction applications.
• Emerging applications in commercial / residential areas: HVAC, Induction cooking, lighting, computer power etc.
• The cost of using power electronics will depend on factors like: • Recycling • Standards regarding EMI • Intelligence / protection • Modular converters • Reliability considerations • Thermal engineering • Electromagnetic Integration
• Silicon carbide is an important future development in power semi-conductors.
• Distributed generation and power quality are important future considerations.
• For very high-power applications, modularization will be expanding, provided the system cost, efficiency, flexibility and EMC are acceptable.
• For medium-power applications, the total system integration still leaves a lot of room for improvements in cost, power modules, control and sensing, passives, reliability and performance.
• Fast energy storage is required in numerous applications. At present, super capacitors seem to be the most promising solution for energies upto 5 kWh. In the next ten years, all other energy storage options will continue to be considered.
• Applications in power transmission include HVDC converter stations, Flexible AC Transmission Systems (FACTS).
• Applications in power distribution include DC-DC converters, Dynamic filters, frequency conversion and Custom Power Devices.

The on-going development of interconnection standards and regulations will present both market opportunities and technology challenges for the power electronics industry. Future research and development efforts will need to focus on improving efficiency and reliability, communication and interface, thermal management, reduce parts and points of failure, packaging and bringing down cost.

The range of applications continue to expand in areas such as power supplies to motion control, factory automation, transportation, energy storage, multi-megawatt industrial drives, and electric power transmission/ distribution.